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Tianjin (TJ) Liu is the vice president of Body Component Systems I, II, III and IV for DENSO International America’s (DIAM) Engineering division. As vice president, Liu is responsible for overseeing the research, design and development of instrument clusters, head-up displays, body control modules, memory seat modules, smart systems, relays, climate control panels and electronic control units, haptic control devices, driver status monitors, HCU (HMI Control Unit) and other information and safety products and technologies.
Liu joined DIAM in 1993 as senior engineer in the Driver Information department where he was responsible for cluster design for Chrysler mini-vans. He was promoted to Staff Engineer in 1995 and Manager in 1998. In 2001, Liu was appointed to senior manager of Body Component Systems I, responsible for overseeing the packaging group. He was appointed to director of Body Component Systems I in 2007. In April 2013, Liu was given the additional responsibility for Body Component Systems II and III departments where he oversaw body control modules, memory seat modules, relays, smart systems, and climate control panels/ECU. In July 2015, Liu was given the additional responsibility within Body Component Systems IV for software development.
Prior to joining DENSO, Liu worked as a teacher and research assistant at the University of Hawaii; in Honolulu, Hawaii. He later served as a computer integrated manufacturing specialist at the IBM-Oakland Community College Technical Center in Auburn Hills, Mich.; and as a project engineer at Invenio Engineering Services in Warren, Mich.
Liu received his Bachelor of Science degree in Mechanical Engineering from Zhejiang University in HangZhou, China. He also holds a Master of Science degree in Mechanical Engineering at the University of Hawaii, Honolulu, Hawaii.
He is an active member of the Society of Automotive Engineers (SAE) and Detroit Economic Club.